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Toshiba releases lens-reduction type CCD linear image sensor

India, Aug. 21 -- Toshiba Electronic Devices & Storage Corp. has launched a lens-reduction type CCD linear image sensor "TCD2728DG" for A3 multifunction printers. Shipments have just started. The se... Read More


Teledyne HiRel Semiconductors launches eMMC 5.1 module

India, Aug. 21 -- Teledyne HiRel Semiconductors announced the release of industrial-grade embedded MultiMediaCard (eMMC) module. Featuring 128GB of eMMC 5.1-compliant storage in a compact 153-ball FBG... Read More


Ceva's 20bn device milestone paves way for new era in smart edge innovation

India, Aug. 20 -- In a world increasingly shaped by intelligent devices that connect, sense, and perceive our surroundings, Ceva, Inc., the leading licensor of silicon and software IP for the Smart Ed... Read More


Advanced packaging fuels transformation in back-end equipment: Yole

India, Aug. 20 -- Yole Group announced the release of the first edition of its Status of the Back-End Equipment Industry 2025 report. This new publication offers an unprecedented analysis of a segment... Read More


Baraja appoints IP Pioneer to lead global sale of Spectrum-Scan LiDAR IP assets

India, Aug. 19 -- Baraja Pty Ltd. the Australian pioneer behind the revolutionary Spectrum Scan LiDAR architecture, has announced a global initiative to commercialize its full suite of patented LiDAR ... Read More


China semiconductor for automotive market booms with strong government backing

India, Aug. 19 -- The "China Semiconductor Market for Automotive by Component (Microcontroller, Power Semiconductor, Sensor & MEMS Device, Memory Chip, Analog & Mixed Signal IC), Global & China Semico... Read More


MIPI Alliance releases I3C Basic v1.2 utility and control bus interface

India, Aug. 19 -- The MIPI Alliance, an international organization that develops interface specifications for mobile and mobile-influenced industries, announced the release of MIPI I3C Basic v1.2, a s... Read More


SoftBank Group and Intel sign $2bn investment agreement

India, Aug. 19 -- SoftBank Group Corp. and Intel Corp. announced their signing of a definitive securities purchase agreement, under which SoftBank will make a $2 billion investment in Intel common sto... Read More


Innovation in copper extraction accelerates amid soaring demand

India, Aug. 18 -- New research from Cleantech Group highlights the rising urgency and opportunity in copper extraction innovation, as the global push for electrification collides with strained supply ... Read More


An inside look at Wayfair's India technology development centre

India, Aug. 14 -- In a conversation with Rohit Kaila, Head of Technology and Site Leader at Wayfair India, we explore the strategic evolution of Global Capability Centres (GCCs) in India. Kaila provid... Read More